Closeup of Epoxy Potting for Electronics Encapsulation with Air Voids, Cavities, and Softness in the Resin

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Published: 2024-03-15 19:11:11.027684 Category: Technology Type: Photo Model release: No
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Contributor: Richard
ID : 759094051
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Photo2688x1792


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Keywords
hardening, resin, bubble, electronic, manufacturing, potting, pcb, assembly, time, hole, adhesion, quality control, viscosity


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